Analysis of Temperature Field for Central Electric Junction Box Based on ABAQUS
[1]HE Zhanshu,CHEN Lei,WANG Wujun,et al.Analysis of Temperature Field for Central Electric Junction Box Based on ABAQUS[J].Journal of Zhengzhou University (Engineering Science),2020,41(04):68-73.[doi:10.13705/j.issn.1671-6833.2020.04.001]
Copy
Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
41卷
Number of periods:
2020 04
Page number:
68-73
Column:
Public date:
2020-08-12
- Title:
- Analysis of Temperature Field for Central Electric Junction Box Based on ABAQUS
- Keywords:
- central electrical junction box; contact resistance; contact thermal resistance; temperature field; simulation
- CLC:
- -
- DOI:
- 10.13705/j.issn.1671-6833.2020.04.001
- Abstract:
- Due to the high temperature induced by the generation,the PCB locate in the central electrical junction box (or electrical box) was easily inflammable.It was necessary to investigate the temperature distribution of the PCB.The ABAQUS was used to simulate the temperature of PCB,relay,quick fuse,slow fuse,etc.The corresponding temperature rise experiments were conducted to compare with the simulation results and determine the parameters of each component,which were convective heat transfer coefficient,electrical contact resistance,thermal contact resistance,etc.The simulations and experiments at the assembled level of electrical box were conducted to analyze the influence of each component on the PCB temperature field.The simulation results showed that the temperature rise of PCB decreased with an increase in the width of copper cladding region and increased with an increase of current.Due to the complicated internal structure of the electrical box,the temperature distribution of the PCB was not uniform.The higher temperature of PCB was generated in the joint of large power components and the total entrance of electric current,and the maximum rise of temperature was 38.7 ℃.Through the actual measurement of the temperature of PCB and the electrical box,the measured results were qualitatively and quantitatively consistent with the simulated results.
- References:
-
[1] MASHIMO K,SAITA Y,KOIZUMI K,et al.Heat transfer analysis for vehicle electronic parts[J].Furukawa review,2002(22):1-6.[2] HWANG S Y,LEE J H,VISUWANATHAN K K.Experiments and thermal-electrical analysis of buss bar and relay assemblies in junction blocks[J].International journal of automotive technology,2013,14(1):79-90.[3] ANGADI S V,JACKSON R L,CHOE S Y,et al.A multi-physics finite element model of a 35 A automotive connector including multiscale rough surface contact[J].Journal of electronic packaging,2010,134(1):1-11.[4] MONNIER A,FROIDUROT B,JARRIGE C,et al.A mechanical,electrical,thermal coupled-field simul-ation of a sphere-plane electrical contact[J].IEEE transactions on components and packaging techno-logies,2007,30(4):787-795.[5] ZANDI B,LEWIS J,LEWIS H,et al.Transient coupled thermal/electrical analysis of a printed wiring board[C]//The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.Las Vegas:IEEE,2004:532-536.[6] ZHANG Y,BAGNOLI P E.A modeling methodology for thermal analysis of the PCB structure[J].Microelectronics journal,2014,45(8):1033-1052.[7] 王子建,严飞,侯智剑,等.高压全膜电容器热稳定性能试验条件下的温度场特性[J].电工技术学报,2016,31(17):207-216.[8] 杨文英,郭久威,王茹,等.继电器电磁机构电磁-热耦合模型建立与计算方法[J].电工技术学报,2017,32(13):169-177.[9] 陈国栋,刘宏,王江涛.基于曲线拟合的PEBB单元散热优化设计[J].电工技术学报,2016,31(4):71-78.[10] 贾京,冯士维,邓兵,等.基于热阻测量的PCB散热特性[J].电工技术学报,2014,29(9):239-244.[11] 于岩,朱彦俊,王守绪,等.不同叠层结构印制电路板散热性能研究[J].电子元件与材料,2014,33(1):43-47.[12] CARVOU E,EL ABDI R,RAZAFIARIVELO J,et al.Thermo-mechanical study of a power connector[J].Measurement,2012,45(5):889-896.[13] 王永庆,王芳芳,古新,等.缠绕螺纹管螺旋折流板换热器流动与传热数值分析[J].郑州大学学报(工学版),2019,40(4):92-96.[14] 纽春萍,陈德桂,刘颖异,等.计及主回路和电磁系统发热的交流接触器数值热分析[J].中国电机工程学报,2007,27(15):53-58.[15] 车玉思,王成铎,孙玉福,等.大型竖式还原罐壁面温度分布特性研究[J].郑州大学学报(工学版),2018,39(3):87-92.
- Similar References:
Memo
-
Last Update:
2020-10-06