Preparation and Characterization of Heat-resistant FlexibleModified Epoxy Resin Adhesive
[1]Wang Hong-kai,Ll Hua,Ll Ming-xue,et al.Preparation and Characterization of Heat-resistant FlexibleModified Epoxy Resin Adhesive[J].Journal of Zhengzhou University (Engineering Science),2015,36(04):28-32.[doi:10.3969/ j. issn.1671 -6833.2015.04.007]
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Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
36卷
Number of periods:
2015 04
Page number:
28-32
Column:
Public date:
2015-08-31
- Title:
- Preparation and Characterization of Heat-resistant FlexibleModified Epoxy Resin Adhesive
- Keywords:
- heat-resistant; flexible; modified epoxy resin; organosilicone; preparation; characterization
- CLC:
- TQ433.4
- DOI:
- 10.3969/ j. issn.1671 -6833.2015.04.007
- Abstract:
- A heat-resistant flexible adhesive cured at room-temperature was synthesized with epoxy resin,pol-ysulfide rubber and organosilicone as the first component,polyamide as the second component,and addition ofdifferent modified fller. The modified epoxy resin adhesive has the satisfactory properties of rapid curing rateat room temperature and a suitable toughness and heat resistance. When the adhesive was cured for 72 hours atroom temperature,the shearing strength can be up to 19.84 MPa,the heat resistance can up to 160℃,andthe instantaneous temperature can be over 250 ℃. The modified epoxy resin adhesive has been characterizedby FT-IR,1H NMR,TGA and XRD,and the result showed that the Si-O group improved greatly the thermo-stability of the modified epoxy resin.The XRD analysis showed that the modified 20 diffraction peak was great-ly weakened at 18 °,which indicated that the modified filler can increase the cured degree of modified resinand the cured reaction time. The experimental result in this work provides the theoretical founclation for thesynthesis and application of modified organosilicone epoxy resin.
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