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The Analysis of In-mold Dynamics about the Microfluidic Chips Based on Ansys／ls-Dyna
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[1]JIANG Bingyan,CHEN Wen,YUAN Li,et al.The Analysis of In-mold Dynamics about the Microfluidic Chips Based on Ansys／ls-Dyna[J].Journal of Zhengzhou University (Engineering Science),2010,31(02):91-.
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Journal of Zhengzhou University (Engineering Science)[ISSN 1671-6833/CN 41-1339/T] Volume: 31卷 Number of periods: 2010 No.02 Page number: 91- Column: Public date: 2010-02-02
Title:
The Analysis of In-mold Dynamics about the Microfluidic Chips Based on Ansys／ls-Dyna
Author(s):
JIANG Bingyan; CHEN Wen; YUAN Li; etc
Key Laboratory of Modem Complex Equipment Design and Extreme Manufacturing Ministry of Education，Central South University，Changsha 410083，China
Keywords:
in-mold assemble; mold cavities alignment; ANSYS／LS-DYNA; mold life
CLC:
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DOI:
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Abstract:
With the finite elements model based on system dynamical theory and with the help of ANSYS／LS-DYNA，the research simulates the in-mold dynamics for microfluidic chips．Based on the results of thesimulation，the research shows that：the maximum Von raises stress is below the materials summit limits；thekey points displacements have certain impact on the alignment precision of the mold cavities．The researchprovides the theory for the in—mold assemble(IMA)technology．
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