[1]SUN Xiaofeng,Ma Shining,Zhu Naishu,et al.Effect of nano-microwave absorber on microwave curing performance of modified epoxy adhesive[J].Journal of Zhengzhou University (Engineering Science),2008,29(04):14-16.[doi:10.3969/j.issn.1671-6833.2008.04.004]
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Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
29
Number of periods:
2008年04期
Page number:
14-16
Column:
Public date:
1900-01-01
- Title:
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Effect of nano-microwave absorber on microwave curing performance of modified epoxy adhesive
- Author(s):
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SUN Xiaofeng; Ma Shining; Zhu Naishu; etc
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- Keywords:
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- CLC:
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- DOI:
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10.3969/j.issn.1671-6833.2008.04.004
- Abstract:
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Four typical nanomaterials were selected as microwave absorbers to study their effects on the curing time and mechanical properties of modified epoxy Vitex under microwave action. The results show that under the same curing conditions, the microwave curing time of the modified epoxy adhesive can be significantly reduced. With the increase of the amount of addition, the curing time is greatly shortened, among which nanoFe and nano siOx are particularly prominent. When the mass fraction is added more than 4%, the curing time is less than 3 min. The mechanical property test shows that after adding nano-Fe and nano-Fe5)3, the tensile strength and elastic modulus of the adhesive after microwave curing have no significant change, and when the mass fraction is added to 4%, the tensile strength is 4.33 MPa and 8.34 MPa, respectively. After adding nano-siOx and SiC, the tensile strength and elastic modulus values decreased slightly.