Under the action of temperature load and high temperature and high humidity load, the force analysis of the TAB specimen bonded by anisotropic conductive adhesive was carried out, and the relationship between bonding interface stress and strain under temperature and high temperature and high humidity load was established through the force analysis of the thin film beam element by beam theory, and the singular differential equation with function was used to solve it, and the interface normal stress and shear stress distribution results obtained by finite element numerical simulation were compared, and the calculation results were similar to the numerical simulation results, which verified the correctness of the calculation .