Damage studies of bonding interfaces

interface;  bonding;  peel strength;  Interface damage constitutive mode

The bonding interface constitutive model is applied to the commercial anisotropic conductive adhesive-bonded specimens, and the cracking of the 90° peel of the specimen is calculated by this model. Through the correction of the bonding interface model, the interface damage factor x is added on the basis of the original interface model, and the calculation formulas of temperature cycle damage factor and high temperature and high humidity damage factor are given according to the experimental data. The damage factor can not only change the maximum stress value of the bond, but also change the displacement of the cracking of the bonding interface. The interface constitutive with damage factor can describe the change of bonding strength of specimens after temperature cycling and high temperature and high humidity test, and the calculation results of this interface damage model are in good agreement with the experimental results.