reparation of a Soluble Polyimide used for UV Resin Modification
[1]Shi Xiaohua,Yan Shaoge,Zhang Weijie.reparation of a Soluble Polyimide used for UV Resin Modification[J].Journal of Zhengzhou University (Engineering Science),2016,37(05):17-22.[doi:10.13705/j.issn.1671-6833.2016.05.004]
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Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
37
Number of periods:
2016 05
Page number:
17-22
Column:
Public date:
2016-11-25
- Title:
- reparation of a Soluble Polyimide used for UV Resin Modification
- CLC:
- -
- Abstract:
- Aiming at the deficiencies in flexibility and heat resistance of epoxy acrylic resin when it is applied to UV photocurable solder resist ink for flexible circuit boards, a kind of epoxy acrylic resin with suitable molecular weight was prepared by different monomer combinations and imidization method. and soluble polyimide with good heat resistance, and used it to modify epoxy acrylic resin. The results show that the best process for preparing the polyimide (PI) is to mix the molar ratio of 1:0.505:0.505 3,4’-ODA, BPDA, ODPA were reacted for 2 hours to synthesize polyamic acid (PAA), and then the polyamic acid was synthesized at 90°C by the chemical imine method of adding catalyst triethylamine and dehydrating agent acetic anhydride. Dehydration for 4 hours to synthesize polyimide. The polyimide synthesized under this condition has a molecular weight of 2.64×104 and a decomposition temperature of 508°C. It is used for modification of epoxy acrylic resin to increase the decomposition temperature of the product from 291°C to 374°C. , the heat resistance has been improved.
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