Heat Dissipation Analysis of Electronic Equipment in High Altitude Area
[1]HUANG Yanping,CAO Guohua,WANG Shukun.Heat Dissipation Analysis of Electronic Equipment in High Altitude Area[J].Journal of Zhengzhou University (Engineering Science),2014,35(06):113-117.[doi:10.3969/j.issn.1671-6833.2014.06.027]
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Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
35
Number of periods:
2014 06
Page number:
113-117
Column:
Public date:
2014-11-25
- Title:
- Heat Dissipation Analysis of Electronic Equipment in High Altitude Area
- Keywords:
- eleetronie equipment; high altitude cooling; ICEPAK; turbulenee theory; two equation model
- CLC:
- TK124
- Abstract:
- Heat dissipation capacity of eleelronie equipment inlluenees not only its stability, but the servicelife of the components. E’speeially in the high-altitude area with thin air and low air pressure, heat dissipationperformanee is more likely to deteriorate in closed chassis. In order to study heat dissipation problem of elee.tronie equipment at the high altitude, based on the turbulenee theory, eooling flow mathematieal model olchassis was established. By means of lCEPAK, an eleelronie thermal design specialized soltware , the heat dis.sipation of different altitudes were simulated. The theory that two-equation turbulenee model for eooling ealeu.lation in thin air area should be more aeeurate, was put forward and verified through the simulation. This willprovide a referenee for the thermal design of eleetronie equipment in high altitude areas.
- References:
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