Anisotropic Conductive Adhesive Film Damage Failure Test and Numerical Analysis
[1]JIA Hong,HUANG Liugang,SUN Weiwei,et al.Anisotropic Conductive Adhesive Film Damage Failure Test and Numerical Analysis[J].Journal of Zhengzhou University (Engineering Science),2009,30(02):31-34.
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Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
30卷
Number of periods:
2009年02期
Page number:
31-34
Column:
Public date:
1900-01-01
- Title:
- Anisotropic Conductive Adhesive Film Damage Failure Test and Numerical Analysis
- Keywords:
- Anisotropic conductive adhesive film; Bonding interface; numerical simulation; Cohesion model
- CLC:
- -
- DOI:
- -
- Abstract:
- Anisotropic conductive adhesive film bonding structure is a widely used connection form in microelectronic packaging. Under the action of external load, the bonding interface is prone to damage and failure, which makes the structure fail. The cohesive zone model was used to simulate the damage and failure of the bonding interface of anisotropic conductive adhesive film bonding structures in peel test by finite element method. By comparing with the corresponding experimental data, the feasibility of the cohesion model for the numerical simulation of damage damage and failure of the bonding interface of conductive adhesive film is verified. The simulation analysis analyzes the relationship between the damage failure of the bonding interface and the opening displacement of the interface, and the calculation results show that the damage of the bonded interface will soon reach failure under the action of peeling force, which will cause the failure of the bonding interface.
- References:
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- Similar References:
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Last Update:
1900-01-01