Research on the process of electroless plating of Ni-Co-P on aluminum matrix
[1]Yang Erbing,Wang Jiemin.Research on the process of electroless plating of Ni-Co-P on aluminum matrix[J].Journal of Zhengzhou University (Engineering Science),2008,29(02):55-58.[doi:10.3969/j.issn.1671-6833.2008.02.014]
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Journal of Zhengzhou University (Engineering Science)[ISSN
1671-6833/CN
41-1339/T] Volume:
29卷
Number of periods:
2008年02期
Page number:
55-58
Column:
Public date:
1900-01-01
- Title:
- Research on the process of electroless plating of Ni-Co-P on aluminum matrix
- CLC:
- -
- DOI:
- 10.3969/j.issn.1671-6833.2008.02.014
- Abstract:
-
The pH value of the plating bath was adjusted with caustic soda, and the process conditions for electroless plating of Ni-co-P alloy on the aluminum matrix were preliminarily determined by orthogonal test: the temperature was 85 °C, and the boric acid was 5 g· L-1,c(H2PO2-)/c(Ni2+Co2+) molar ratio 3, c(Ni2+)/c(Co2+) molar ratio 2, complexing agent 170 g· L-1, complexing agent 215 g· L-1, accelerator 8 g· The L-1PH value was 8.5.4 factors with significant influence on the plating speed were found through range analysis.
- References:
- -
- Similar References:
Memo
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Last Update:
1900-01-01