[1]贺占蜀,陈雷,王武军,等.基于ABAQUS的中央电气接线盒温度场分析[J].郑州大学学报(工学版),2020,41(04):68-73.[doi:10.13705/j.issn.1671-6833.2020.04.001]
 He Zhanshu,Chen Lei,Wang Wujun,et al.Temperature Rise Simulation and Experimental Research of Central Electric Junction Box[J].Journal of Zhengzhou University (Engineering Science),2020,41(04):68-73.[doi:10.13705/j.issn.1671-6833.2020.04.001]
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基于ABAQUS的中央电气接线盒温度场分析()
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《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:
41卷
期数:
2020年04期
页码:
68-73
栏目:
出版日期:
2020-08-12

文章信息/Info

Title:
Temperature Rise Simulation and Experimental Research of Central Electric Junction Box
作者:
贺占蜀陈雷王武军毛建伟
1. 郑州大学机械与动力工程学院2. 河南天海电器有限公司
Author(s):
He Zhanshu1Chen Lei1Wang Wujun2Mao Jianwei2
1. School of Mechanical and Power Engineering, Zhengzhou University 2. Henan Tianhai Electric Appliance Co., Ltd
关键词:
中央电气接线盒' target="_blank" rel="external">">中央电气接线盒接触电阻接触热阻温度场仿真
Keywords:
Central electrical junction box' target="_blank" rel="external">">Central electrical junction boxcontact resistancecontact thermal resistancetemperature fieldEmulation
DOI:
10.13705/j.issn.1671-6833.2020.04.001
文献标志码:
A
摘要:
中央电气接线盒(简称电器盒)内的PCB板容易因发热造成温度过高而燃烧,因此有必要对电器盒内的PCB板的温度分布进行研究。首先,采用ABAQUS软件分别对电器盒内PCB板、继电器、快速熔断器、慢速熔断器等元器件进行温升仿真,并进行相应的温升实验;通过将仿真和实验的温度进行对比,确定各个元器件的对流换热系数和接触面间的接触电阻、接触热阻等参数。随后,集成所有元器件并进行温升仿真与实验,研究此时PCB板的温度分布,并分析各个元器件的温度场在PCB板上的耦合效应。结果表明:PCB板的温升随覆铜区域的宽度增大而减小;PCB板各处的温度分布不均匀,PCB板上温度较高处一般出现在大功率元器件连接位置、电流总入口处以及集成度较高区域。
Abstract:
The ABAQUS is used to simulate the temperature of PCB, relay, quick fuse, slow fuse, etc. The corresponding temperature rise experiments are conducted to compare with the simulation results and determine the parameters of each component which are convective heat transfer coefficient, electrical contact resistance, thermal contact resistance, etc. The simulations and experiments at the assembled level of electrical box are conducted to investigate the temperature distribution of PCB and analyze the coupling effect of each component temperature field in the PCB. The results show: the temperature rise of PCB decreases with an increase in the width of copper cladding region; the temperature distribution of PCB is uneven; the higher temperature of PCB is generated in the joint of large power components, the total entrance of electric current and the highly integrated zone

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更新日期/Last Update: 2020-10-06