[1]贺占蜀,陈雷,王武军,等.基于ABAQUS的中央电气接线盒温度场分析[J].郑州大学学报(工学版),2020,41(04):68-73.[doi:10.13705/j.issn.1671-6833.2020.04.001]
　HE Zhanshu,CHEN Lei,WANG Wujun,et al.Analysis of Temperature Field for Central Electric Junction Box Based on ABAQUS[J].Journal of Zhengzhou University (Engineering Science),2020,41(04):68-73.[doi:10.13705/j.issn.1671-6833.2020.04.001]
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基于ABAQUS的中央电气接线盒温度场分析()
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《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:
41卷
期数:
2020年04期
页码:
68-73
栏目:
出版日期:
2020-08-12

文章信息/Info

Title:
Analysis of Temperature Field for Central Electric Junction Box Based on ABAQUS
作者:
贺占蜀; 陈雷; 王武军; 毛建伟
1. 郑州大学机械与动力工程学院2. 河南天海电器有限公司
Author(s):
HE Zhanshu1; CHEN Lei1; WANG Wujun2; MAO Jianwei2
1.School of Mechanical and Power Engineering,Zhengzhou University,Zhengzhou 450001,China;2.Henan THB Electric Co.,Ltd.,Hebi 458030,China
关键词:
中央电气接线盒' target="_blank" rel="external">">中央电气接线盒; 接触电阻; 接触热阻; 温度场; 仿真; 
Keywords:
central electrical junction box; contact resistance; contact thermal resistance; temperature field; simulation
DOI:
10.13705/j.issn.1671-6833.2020.04.001
文献标志码:
A
摘要:
中央电气接线盒（简称电器盒）内的PCB板容易因发热造成温度过高而燃烧,因此有必要对电器盒内的PCB板的温度分布进行研究。首先，采用ABAQUS软件分别对电器盒内PCB板、继电器、快速熔断器、慢速熔断器等元器件进行温升仿真，并进行相应的温升实验；通过将仿真和实验的温度进行对比，确定各个元器件的对流换热系数和接触面间的接触电阻、接触热阻等参数。随后，集成所有元器件并进行温升仿真与实验，研究此时PCB板的温度分布，并分析各个元器件的温度场在PCB板上的耦合效应。结果表明：PCB板的温升随覆铜区域的宽度增大而减小；PCB板各处的温度分布不均匀，PCB板上温度较高处一般出现在大功率元器件连接位置、电流总入口处以及集成度较高区域。
Abstract:
Due to the high temperature induced by the generation,the PCB locate in the central electrical junction box (or electrical box) was easily inflammable.It was necessary to investigate the temperature distribution of the PCB.The ABAQUS was used to simulate the temperature of PCB,relay,quick fuse,slow fuse,etc.The corresponding temperature rise experiments were conducted to compare with the simulation results and determine the parameters of each component,which were convective heat transfer coefficient,electrical contact resistance,thermal contact resistance,etc.The simulations and experiments at the assembled level of electrical box were conducted to analyze the influence of each component on the PCB temperature field.The simulation results showed that the temperature rise of PCB decreased with an increase in the width of copper cladding region and increased with an increase of current.Due to the complicated internal structure of the electrical box,the temperature distribution of the PCB was not uniform.The higher temperature of PCB was generated in the joint of large power components and the total entrance of electric current,and the maximum rise of temperature was 38.7 ℃.Through the actual measurement of the temperature of PCB and the electrical box,the measured results were qualitatively and quantitatively consistent with the simulated results.

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更新日期/Last Update: 2020-10-06