[1]蒋炳炎,陈闻,袁理,等.基于ANSYS/LS-DYNA的微流控芯片模内动力学特性研究[J].郑州大学学报(工学版),2010,31(02):91.[doi:10.3969/j.issn.1671-6833.2010.02.022]
Jiang Bingyan,CHEN Wen,Yuan Li,et al.Study on in-mold dynamics of microfluidic chips based on ANSYS/LS-DYNA[J].Journal of Zhengzhou University (Engineering Science),2010,31(02):91.[doi:10.3969/j.issn.1671-6833.2010.02.022]
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基于ANSYS/LS-DYNA的微流控芯片模内动力学特性研究(
)
《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]
- 卷:
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31卷
- 期数:
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2010年02期
- 页码:
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91
- 栏目:
-
- 出版日期:
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2010-02-02
文章信息/Info
- Title:
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Study on in-mold dynamics of microfluidic chips based on ANSYS/LS-DYNA
- 作者:
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蒋炳炎; 陈闻; 袁理; 等.
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中南大学,现代复杂装备设计与极端制造教育部重点实验室,湖南,长沙,410083, 中南大学,现代复杂装备设计与极端制造教育部重点实验室,湖南,长沙,410083, 中南大学,现代复杂装备设计与极端制造教育部重点实验室,湖南,长沙,410083, 中南大学,现代复杂装备设计与极端制造教育部重点实验室,湖南,长沙,410083
- Author(s):
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Jiang Bingyan; CHEN Wen; Yuan Li; etc
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- 关键词:
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模内键合; 模芯运动定位; 有限元显式动力学分析; 模具寿命
- Keywords:
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- DOI:
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10.3969/j.issn.1671-6833.2010.02.022
- 文献标志码:
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A
- 摘要:
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以有限元法的系统动力学理论为基础,采用显式ANSYS/LS-DYNA有限元分析软件对微流控芯片模内键合模具模内运动元件进行了模拟仿真计算,并对计算结果进行分析.以计算结果为依据,对模具的结构进行改进,优化其结构,改善受力状况.研究结果表明:模内元件最大应力值均在各元件材料屈服极限范围内;关键结点位移对模腔对准精度产生一定影响.研究结果为模内装配模具(IMA)结构设计开发提供了理论依据,对深入研究模芯制动与模具疲劳寿命间关系及提高模具寿命提供了理论.
- Abstract:
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Based on the system dynamics theory of finite element method, explicit ANSYS/LS-DYNA finite element analysis software was used to simulate and calculate the in-mold motion elements of microfluidic chip in-mold bonding mold, and the calculation results were analyzed. Based on the calculation results, the structure of the mold is improved, its structure is optimized, and the force condition is improved. The results show that the maximum stress value of the in-mold element is within the yield limit of each component material. The displacement of the key junction has a certain influence on the alignment accuracy of the cavity. The research results provide a theoretical basis for the structural design and development of in-mold assembly mold (IMA), and provide a theory for in-depth study of the relationship between mold core braking and mold fatigue life and improve mold life.
更新日期/Last Update:
1900-01-01