[1]贾宏,黄刘刚,孙维威,等.各向异性导电胶膜损伤破坏试验与数值分析[J].郑州大学学报(工学版),2009,30(02):31-34.[doi:10.3969/j.issn.1671-6833.2009.02.008]
　JIA Hong,HUANG Liugang,SUN Weiwei,et al.Anisotropic conductive adhesive film damage failure test and numerical analysis[J].Journal of Zhengzhou University (Engineering Science),2009,30(02):31-34.[doi:10.3969/j.issn.1671-6833.2009.02.008]

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各向异性导电胶膜损伤破坏试验与数值分析()

分享到：

《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:

30卷

期数:

2009年02期

页码:

31-34

栏目:

出版日期:

1900-01-01

文章信息/Info

Title:

Anisotropic conductive adhesive film damage failure test and numerical analysis

作者:

贾宏; 黄刘刚; 孙维威; 等.

郑州大学化学工程学院,河南,郑州,450001, 北京交通大学机电学院,北京,100044

Author(s):

JIA Hong; HUANG Liugang; SUN Weiwei; etc

关键词:

各向异性导电胶膜;  粘接界面;  数值模拟;  内聚力模型

Keywords:

Anisotropic conductive adhesive film;  Bonding interface;  numerical simulation;  Cohesion model

DOI:

10.3969/j.issn.1671-6833.2009.02.008

文献标志码:

A

摘要:

各向异性导电胶膜粘接结构是微电子封装中广泛应用连接形式.粘接结构在外载荷的作用下,粘接界面容易出现损伤与破坏从而使得结构失效.运用内聚力模型(cohesive zone model))用有限元方法模拟了各向异性导电胶膜粘接结构在剥离测试中的粘接界面损伤与破坏的过程.通过与相应的试验数据比较,验证了内聚力模型对于导电胶膜粘接界面损伤破坏数值模拟的可行性.模拟计算分析了粘接界面损伤破坏与界面张开位移的关系,计算结果表明,粘接界面在剥离力的作用下,出现损伤后将很快达到破坏进而引起粘接界面的失效.

Abstract:

Anisotropic conductive adhesive film bonding structure is a widely used connection form in microelectronic packaging. Under the action of external load, the bonding interface is prone to damage and failure, which makes the structure fail. The cohesive zone model was used to simulate the damage and failure of the bonding interface of anisotropic conductive adhesive film bonding structures in peel test by finite element method. By comparing with the corresponding experimental data, the feasibility of the cohesion model for the numerical simulation of damage damage and failure of the bonding interface of conductive adhesive film is verified. The simulation analysis analyzes the relationship between the damage failure of the bonding interface and the opening displacement of the interface, and the calculation results show that the damage of the bonded interface will soon reach failure under the action of peeling force, which will cause the failure of the bonding interface.

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