[1]石晓华,颜少鸽,张炜婕.用于UV树脂改性的可溶性聚酰亚胺的制备工艺[J].郑州大学学报(工学版),2016,37(05):17-22.[doi:10.13705/j.issn.1671-6833.2016.05.004]
　Shi Xiaohua,Yan Shaoge,Zhang Weijie.reparation of a Soluble Polyimide used for UV Resin Modification[J].Journal of Zhengzhou University (Engineering Science),2016,37(05):17-22.[doi:10.13705/j.issn.1671-6833.2016.05.004]
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用于UV树脂改性的可溶性聚酰亚胺的制备工艺()
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《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:
37
期数:
2016年05期
页码:
17-22
栏目:
出版日期:
2016-11-25

文章信息/Info

Title:
reparation of a Soluble Polyimide used for UV Resin Modification
作者:
石晓华; 颜少鸽; 张炜婕
郑州大学化学工程与能源学院,河南郑州,450001
Author(s):
Shi Xiaohua;  Yan Shaoge;  Zhang Weijie
School of Chemical Engineering and Energy, Zhengzhou University, Zhengzhou, Henan 450001
关键词:
聚酰亚胺; 可溶性; 环氧丙烯酸树脂; 改性制备
Keywords:
DOI:
10.13705/j.issn.1671-6833.2016.05.004
文献标志码:
A
摘要:
针对环氧丙烯酸树脂在应用于柔性电路板UV光固化阻焊油墨时所表现出的柔韧性、耐热性等方面的不足,通过不同单体组合和亚胺化法制备出一种具有合适分子量和耐热性良好的可溶性聚酰亚胺,并用其对环氧丙烯酸树脂改性.结果表明:制备该聚酰亚胺(PI)的较佳工艺过程为在0℃的温度下将摩尔比为1:0.505:0.505的3,4’-ODA、BPDA、ODPA反应2h合成聚酰胺酸(PAA),再通过加入催化剂三乙胺和脱水剂乙酸酐的化学亚胺法在90℃将聚酰胺酸脱水4h合成聚酰亚胺.该条件下合成的聚酰亚胺分子量为2.64×104,分解温度为508℃,用于环氧丙烯酸树脂改性使产物分解温度由原来的291℃提升至374℃,耐热性有所提高.
Abstract:
Aiming at the deficiencies in flexibility and heat resistance of epoxy acrylic resin when it is applied to UV photocurable solder resist ink for flexible circuit boards, a kind of epoxy acrylic resin with suitable molecular weight was prepared by different monomer combinations and imidization method. and soluble polyimide with good heat resistance, and used it to modify epoxy acrylic resin. The results show that the best process for preparing the polyimide (PI) is to mix the molar ratio of 1:0.505:0.505 3,4’-ODA, BPDA, ODPA were reacted for 2 hours to synthesize polyamic acid (PAA), and then the polyamic acid was synthesized at 90°C by the chemical imine method of adding catalyst triethylamine and dehydrating agent acetic anhydride. Dehydration for 4 hours to synthesize polyimide. The polyimide synthesized under this condition has a molecular weight of 2.64×104 and a decomposition temperature of 508°C. It is used for modification of epoxy acrylic resin to increase the decomposition temperature of the product from 291°C to 374°C. , the heat resistance has been improved.
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