[1]王红凯,李华,李明雪,等.增韧耐温改性环氧树脂的制备及其表征[J].郑州大学学报(工学版),2015,36(04):28-32.[doi:10.3969/ j. issn.1671 -6833.2015.04.007]
　Wang Hong-kai,Ll Hua,Ll Ming-xue,et al.Preparation and Characterization of Heat-resistant FlexibleModified Epoxy Resin Adhesive[J].Journal of Zhengzhou University (Engineering Science),2015,36(04):28-32.[doi:10.3969/ j. issn.1671 -6833.2015.04.007]
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增韧耐温改性环氧树脂的制备及其表征()
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《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:
36
期数:
2015年04期
页码:
28-32
栏目:
出版日期:
2015-08-31

文章信息/Info

Title:
Preparation and Characterization of Heat-resistant FlexibleModified Epoxy Resin Adhesive
作者:
王红凯1; 李华2; 李明雪2; 郭青青2; 李―静2; 廖钟玲2; 苏媛3
1.中国平煤神马集团开封兴化精细化工有限公司,河南开封475003;2.郑州大学化工与能源学院,河南郑州450001
Author(s):
Wang Hong-kai1; 2; Ll Hua1; Ll Ming-xue1; GUo Qing-qing ; Ll Jing1; LIA0 Zhong-ling; SU Yuan1
1.China PingMei ShenMa Group Kaifeng Xinghua Fine Chemical Co.,LTD，Kaifeng 475003，China; 2.School of ChemicalEngineering and Energy ,Zhengzhou University ，Zhengzhou 450001 ,China
关键词:
耐热; 柔性; 改性环氧树脂﹔有机硅树脂﹔制备; 表征
Keywords:
heat-resistant; flexible; modified epoxy resin; organosilicone; preparation; characterization
分类号:
TQ433.4
DOI:
10.3969/ j. issn.1671 -6833.2015.04.007
文献标志码:
A
摘要:
采用有机硅树脂及聚硫橡胶对环氧树脂进行改性,以聚酰胺为主固化剂,并在固化剂中引入含苯环结构的固化剂,辅以不同比例的改性填料,制备出能在160 ℃条件下长期使用的耐高温胶黏剂,该胶黏剂室温固化72h剪切强度即可达到19.84 MPa ,其耐热性达到了160 ℃ ,瞬间使用温度在250℃以上,并用FT-IR , ’H-NMR对产物进行了结构表征,采用TGA分析了含硅环氧树脂的热稳定性,结果表明:Si—O基团的引入大大提高了环氧树脂的热稳定性;并对固化体系进行了XRD衍射,通过对XRD衍射曲线进行分析,结果显示,改性后固化物20衍射角在18°附近衍射峰有较大幅度减弱,这说明固化72 h后,改性后固化度更高.这为含硅环氧树脂的应用提供了理论依据.
Abstract:
A heat-resistant flexible adhesive cured at room-temperature was synthesized with epoxy resin,pol-ysulfide rubber and organosilicone as the first component,polyamide as the second component,and addition ofdifferent modified fller. The modified epoxy resin adhesive has the satisfactory properties of rapid curing rateat room temperature and a suitable toughness and heat resistance. When the adhesive was cured for 72 hours atroom temperature,the shearing strength can be up to 19.84 MPa,the heat resistance can up to 160℃,andthe instantaneous temperature can be over 250 ℃. The modified epoxy resin adhesive has been characterizedby FT-IR,1H NMR,TGA and XRD,and the result showed that the Si-O group improved greatly the thermo-stability of the modified epoxy resin.The XRD analysis showed that the modified 20 diffraction peak was great-ly weakened at 18 °,which indicated that the modified filler can increase the cured degree of modified resinand the cured reaction time. The experimental result in this work provides the theoretical founclation for thesynthesis and application of modified organosilicone epoxy resin.

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