[1]贾宏,张军,王定标..高温高湿下各向异性导电胶粘接界面的受力分析[J].郑州大学学报(工学版),2008,29(03):81-84.[doi:10.3969/j.issn.1671-6833.2008.03.021]
　JIA Hong,ZHANG Jun,Wang Dingjiao.Force analysis of anisotropic conductive adhesive bonding interface at high temperature and high humidity[J].Journal of Zhengzhou University (Engineering Science),2008,29(03):81-84.[doi:10.3969/j.issn.1671-6833.2008.03.021]

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高温高湿下各向异性导电胶粘接界面的受力分析()

分享到：

《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:

29

期数:

2008年03期

页码:

81-84

栏目:

出版日期:

1900-01-01

文章信息/Info

Title:

Force analysis of anisotropic conductive adhesive bonding interface at high temperature and high humidity

作者:

贾宏; 张军; 王定标.

郑州大学,化工学院,河南,郑州,450001, 郑州大学,化工学院,河南,郑州,450001, 郑州大学,化工学院,河南,郑州,450001

Author(s):

JIA Hong; ZHANG Jun; Wang Dingjiao

关键词:

各向异性导电胶;  界面应力;  温度载荷;  湿度载荷

Keywords:

Anisotropic conductive adhesive;  interfacial stress;  temperature load;  Humidity load

DOI:

10.3969/j.issn.1671-6833.2008.03.021

文献标志码:

A

摘要:

在温度载荷和高温高湿载荷的作用下,对各向异性导电胶粘接的TAB试件进行受力分析,通过梁理论对薄膜梁单元的受力分析,建立了在温度和高温高湿载荷作用下粘接界面应力与应变关系,采用带有函数的奇异微分方程来求解,得到界面正应力和剪应力分布情况,并与有限元数值模拟得到的界面应力分布结果进行比较,计算结果和数值模拟结果相近,验证了计算的正确性.

Abstract:

Under the action of temperature load and high temperature and high humidity load, the force analysis of the TAB specimen bonded by anisotropic conductive adhesive was carried out, and the relationship between bonding interface stress and strain under temperature and high temperature and high humidity load was established through the force analysis of the thin film beam element by beam theory, and the singular differential equation with function was used to solve it, and the interface normal stress and shear stress distribution results obtained by finite element numerical simulation were compared, and the calculation results were similar to the numerical simulation results, which verified the correctness of the calculation .

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