[1]张军,陈旭,贾宏..粘接界面的损伤研究[J].郑州大学学报(工学版),2006,27(02):48-51.[doi:10.3969/j.issn.1671-6833.2006.02.012]
　ZHANG Jun,CHEN Xu,Jia Hong.Damage studies of bonding interfaces[J].Journal of Zhengzhou University (Engineering Science),2006,27(02):48-51.[doi:10.3969/j.issn.1671-6833.2006.02.012]

点击复制

粘接界面的损伤研究()

分享到：

《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]

卷:

27

期数:

2006年02期

页码:

48-51

栏目:

出版日期:

1900-01-01

文章信息/Info

Title:

Damage studies of bonding interfaces

作者:

张军; 陈旭; 贾宏.

郑州大学化工学院,河南,郑州,450002, 天津大学化工学院,天津,300072

Author(s):

ZHANG Jun; CHEN Xu; Jia Hong

关键词:

界面;  粘接;  剥离强度;  界面损伤本构模

Keywords:

interface;  bonding;  peel strength;  Interface damage constitutive mode

DOI:

10.3969/j.issn.1671-6833.2006.02.012

文献标志码:

A

摘要:

把粘接界面本构模型应用到商用的各向异性导电胶粘接的试件中,并用此模型计算试件的90°剥离的开裂.通过对粘接界面模型的修正,在原界面模型的基础上,增加了界面损伤因子x,根据实验数据分别给出了温度循环损伤因子和高温高湿损伤因子计算公式.损伤因子不但能改变粘接的最大应力值,也能改变粘接界面开裂的位移.有损伤因子的界面本构能够描述温度循环和高温高湿试验后试件粘结强度的变化,此界面损伤模型的计算结果与实验结果吻合较好.

Abstract:

The bonding interface constitutive model is applied to the commercial anisotropic conductive adhesive-bonded specimens, and the cracking of the 90° peel of the specimen is calculated by this model. Through the correction of the bonding interface model, the interface damage factor x is added on the basis of the original interface model, and the calculation formulas of temperature cycle damage factor and high temperature and high humidity damage factor are given according to the experimental data. The damage factor can not only change the maximum stress value of the bond, but also change the displacement of the cracking of the bonding interface. The interface constitutive with damage factor can describe the change of bonding strength of specimens after temperature cycling and high temperature and high humidity test, and the calculation results of this interface damage model are in good agreement with the experimental results.

常用功能