[1]冯辉.锡镍合金电镀工艺的研究[J].郑州大学学报(工学版),1990,11(02):72-76.
Feng Hui,Research on Tin Nickel Alloy Electroplating Process[J].Journal of Zhengzhou University (Engineering Science),1990,11(02):72-76.
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锡镍合金电镀工艺的研究(
)
《郑州大学学报(工学版)》[ISSN:1671-6833/CN:41-1339/T]
- 卷:
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11卷
- 期数:
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1990年02期
- 页码:
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72-76
- 栏目:
-
- 出版日期:
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1990-06-28
文章信息/Info
- Title:
-
Research on Tin Nickel Alloy Electroplating Process
- 作者:
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冯辉;
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郑州轻工业学院,
- Author(s):
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Feng Hui;
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Zhengzhou Institute of Light Industry,
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- 关键词:
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锡镍; 电镀
- Keywords:
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Tin nickel; electroplating
- 文献标志码:
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A
- 摘要:
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本文以电化学方法对氟化物体系电镀锡镍合金的工艺进行了研究,从实践中发现使用添加剂T时,可使工艺的oH值范围从4.2—4.5增宽为3.8—5. 同时还发现镀液中含锡量大小对镀层质量也有显著影响.通过大量试验,确定了该工艺的最佳配方及工艺条件.
- Abstract:
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In this article, the electrochemical method has studied the technology of the fluoride system electroplating nickel alloy. From practice, when the use of additive T, the range of the OH value of the process can be widened from 4.2-4.5 to 3.8-5. At the same time, it is found that the tin content in the plating also has a significant impact on the mass of the plating. Through a large number of experiments, the best formula and craft conditions of the process are determined.
更新日期/Last Update:
1900-01-01